Certain Micro
Process Capability
LASER micro-drilling process capability(for MEMS)
Materials: Si3N4, PH II, PH IIS
Hole shapes : round holes, square holes, through holes, stepped holes, tapper holes.
Process capability:
Aspect <= 15, with R0.005
Square hole with arc angle 5um max.
Min. square hole size: 30um * 30um*0.25mm , with gape 12um min.
