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探針卡零組件

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探針卡(probe card)為晶圓測試時的重要測試介面,製程上包含多項先進製造技術。晶圓在未切割、IC封裝前須透過Probe Card測試晶圓品質,以避免不良品封裝,是積體電路製造中影響甚巨的重要技術與介面。本公司在探針卡零組件製造領域深耕多年,不斷地提升各零組件的加工精度,以達到探針卡的最佳使用效果,讓客戶可以在使用探針卡時能發揮最精準的檢測功能。

產品介紹
垂直式探針技術規格

Probe Size 5 mils 4 mils 3 mils
Probe Shape Flat Pointed / Flat Pointed / Flat
Probe Material Paliney 7 Paliney 7 Paliney 7
Probe Force (g/mil) 2.7 2.4 1.8
Max Current (DC) 550mA 480mA 340mA
Contact Resistance <5Ω <5Ω <5Ω
Minimum Pitch (x,y) 195um x 180um 180um x 160um 145um x 135um
Tip Length (+/- 1mil) 30mil 30mil 20mil
Testing Temperature 0 ~ +150°C 0 ~ +150°C 0 ~ +150°C
Tip Diameter Pointed 0.40 ~ 0.70mil 0.40 ~ 0.70mil 0.40 ~ 0.70mil
Flat 5mil 4mil 3mil
Alignment Pointed +/- 0.5mil +/- 0.5mil +/- 0.5mil
Flat +/- 0.7mil +/- 0.7mil +/- 0.7mil
Planarity Pointed +/- 1.5mil +/- 1.5mil +/- 1.5mil
Flat +/- 0.7mil +/- 0.7mil +/- 0.7mil
OverDrive (mils) Pointed 3 ~ 5mil 3 ~ 5mil 3 ~ 5mil
Flat 3 ~ 5mil 3 ~ 5mil 3 ~ 5mil
OverDrive (mils,max) 6mil 6mil 6mil