Ceramic micro-mechanical drilling is the critical technique in vertical wafer card fabrication. We have the process capability to the least hole diameter of ∅20μm and hole pitch of 30μm, and the aspect ratio of 10. The diameter precision and position error of a single hole can reach to ±2μm. The sizes are complete. In additional to the single-through hole, CMAT also provide the services of POGOPIN hole, two-step hole, three-step hole, and chamfering of micro-hole.
Other materials, such as stainless, alumina alloy, and engineering plastic (PEEK, VESPEL) etc., can also be fabricated. Any requirements in micro-hole drilling, welcome to inquire, we will reply soon.